Device enclosure

ABSTRACT

An element for an electronic device can include a metal exterior portion including a first material, an interior portion including a second, independently selected material, and an engagement feature formed on a surface defined by the exterior and interior portions. The engagement feature can mechanically engage a material molded to the surface. A method for forming an element for an electronic device can include joining a boss to a member, forming a feature in the member while orienting the member via the boss, and at least partially removing the boss to form the element. An electronic device can include a frame defining an interior volume of the device, a display component, a transparent cover positioned adjacent to the display component, and an encapsulating material at least partially surrounding the display component and joining the display component to the frame.

CROSS-REFERENCE TO RELATED APPLICATION(S)

This application claims priority to U.S. Provisional Patent ApplicationNo. 62/784,066, filed Dec. 21, 2018, and entitled “DEVICE ENCLOSURE,”the entire disclosure of which is hereby incorporated by reference.

FIELD

The described embodiments relate generally to electronic devices. Moreparticularly, the present embodiments relate to enclosures forelectronic devices.

BACKGROUND

Electronic devices are widespread in society and can take a variety offorms, from wristwatches to computers. Electronic devices, includingportable electronic devices such as handheld phones, tablet computers,and watches, can experience contact with various surfaces during use.Further, use, transportation, and storage of such devices can exertmechanical and thermal stresses thereon.

Components for these devices, such as enclosures or housings, canbenefit from exhibiting different combinations of properties relating tothe use of the device. A housing for a portable electronic device canhave a combination of properties, such as strength, appearance,toughness, abrasion resistance, weight, corrosion resistance, thermalconductivity, electromagnetic shielding, and cost, in order for thedevice to function as desired. Certain materials can provide a desiredlevel of performance with respect to some properties, but may notprovide an optimal level of performance with respect to other others.Thus, it can be desirable to provide a device enclosure includingmultiple materials to achieve a desired combination of somewhatdisparate properties.

Further, the combination of multiple materials in complex designconfigurations can introduce complications into traditionalmanufacturing processes. For example, device enclosures formed ofmultiple materials can require increased processing time, material, andcost when manufactured using traditional techniques. In some examples,common manufacturing processes may not be able to produce a deviceenclosure with a desired combination of properties. Accordingly, it canbe desirable to provide processing and manufacturing techniques that canallow for efficient, low cost, and low waste production of deviceenclosures having a desired combination of differing properties.

SUMMARY

According to some aspects of the present disclosure, a method of forminga frame element for an electronic device can include joining a boss toan elongate frame member, forming a feature in the frame member by amanufacturing process, wherein the frame member is oriented in one ormore desired positions during the manufacturing process via the boss,and removing the boss from the frame member to form the frame element.

In some examples, the manufacturing process can be a subtractivemanufacturing process and the boss can be configured to engage apositioning apparatus and to mechanically support the frame member asthe positioning apparatus orients the frame member in the one or moredesired positions to allow for removal of material from a desiredportion of the frame member during the subtractive manufacturingprocess. Removing the boss can include removing material from the bossto form a feature on the frame member. The manufacturing process caninclude a machining process. Joining can include welding, brazing,diffusion bonding, or adhering, for example, by gluing.

According to some aspects, a housing of an electronic device can includea pre-formed outer portion including a first material having a first setof material properties, the outer portion at least partially defining afeature and an exterior surface of the electronic device, an innerportion including a second material having a second set of materialproperties independent of the first set of material properties, theinner portion at least partially defining the feature and an innervolume of the electronic device, the inner portion being joined to thepre-formed outer portion to form a composite body, and an engagementfeature configured to mechanically engage a moldable material, theengagement feature positioned at a surface of the housing defined by theinner portion and the pre-formed outer portion.

In some examples, the engagement feature can include at least one of anano-structured or micro-structured feature. The engagement feature canbe formed by an etching or machining process. The engagement feature canbe formed by an additive manufacturing process.

According to some aspects, a method of forming a component for anelectronic device can include joining a metal portion including a firstmaterial having a first material property to a second portion includinga second material having a second material property independent of thefirst material property, forming one or more features in the secondportion, and treating a surface defined by the metal portion and thesecond portion to form an engagement feature.

In some examples, the method can further include molding a material tothe surface to mechanically engage the engagement feature. Joining caninclude welding, brazing, diffusion bonding, die casting the secondmaterial into the metal portion, or adhering. Treating the surface caninclude etching the surface or depositing material onto the surface.

According to some aspects, an electronic device can include a frameelement including a surface that at least partially defines an exteriorsurface of the electronic device, a display component, a transparentcover disposed adjacent to the display component, and an encapsulatingmaterial in contact with and at least partially surrounding a peripheryof the display component, the encapsulating material bonded to the frameelement and positioned interior to the surface.

In some examples, an edge of the transparent cover and an edge of themoldable material can be aligned in a plane. The plane can besubstantially parallel to and spaced apart from a wall of the frameelement. The encapsulating material can be bonded to the frame elementwith an adhesive.

According to some aspects, a method of forming an electronic device caninclude at least partially surrounding a periphery of a displaycomponent with a moldable material, positioning a transparent coveradjacent to a surface of the display component, and joining the displaycomponent and transparent cover to a frame element at least partiallydefining an exterior surface of the electronic device by the moldablematerial.

In some examples, joining can include bonding the frame element to themoldable material with an adhesive. An edge of the transparent cover andan edge of the moldable material can be substantially aligned in a planeand the plane is substantially parallel to and spaced apart from a wallof the frame element.

BRIEF DESCRIPTION OF THE DRAWINGS

The disclosure will be readily understood by the following detaileddescription in conjunction with the accompanying drawings, wherein likereference numerals designate like structural elements, and in which:

FIG. 1 shows a perspective view of an electronic device.

FIG. 2 shows an exploded view of an electronic device.

FIG. 3 shows an exploded view of a housing of an electronic device.

FIG. 4A shows an exploded perspective view of a component of anelectronic device.

FIG. 4B shows a perspective view of a component of an electronic device.

FIG. 5 shows a perspective view of a portion of a housing of anelectronic device.

FIG. 6 shows another perspective view of the portion of the housing ofFIG. 5.

FIG. 7 shows a top view of the portion of the housing of FIG. 5.

FIG. 8 shows a side view of the portion of the housing of FIG. 5.

FIG. 9A shows a perspective view of a component of an electronic device.

FIG. 9B shows a perspective view of a component of an electronic device.

FIG. 10 shows a close-up perspective view of a portion of a housing ofan electronic device.

FIG. 11 shows a close-up perspective view of a portion of a housing ofan electronic device.

FIG. 12 shows a profile view of a housing of an electronic device.

FIG. 13 shows a process flow diagram of a method for forming a componentfor an electronic device.

FIG. 14 shows a process flow diagram of stages of a method for forming acomponent for an electronic device.

FIG. 15 shows a process flow diagram of a method for forming a componentfor an electronic device.

FIG. 16 shows a stage of a process for forming a component for anelectronic device.

FIG. 17 shows a stage of a process for forming a component for anelectronic device.

FIG. 18 shows a stage of a process for forming a component for anelectronic device.

FIG. 19 shows a stage of a process for forming a component for anelectronic device.

FIG. 20 shows a process flow diagram of stages of a method for formingan electronic device.

FIG. 21 shows an exploded view of an electronic device.

FIG. 22 shows an exploded cross-sectional view of an electronic device.

FIG. 23 shows a cross-sectional view of the electronic device of FIG.21.

FIG. 24 shows a process flow diagram of a method for forming anelectronic device.

DETAILED DESCRIPTION

The present description provides examples, and is not limiting of thescope, applicability, or configuration set forth in the claims. Thus, itwill be understood that changes can be made in the function andarrangement of elements discussed without departing from the spirit andscope of the disclosure, and various embodiments can omit, substitute,or add other procedures or components as appropriate. For instance,methods described can be performed in an order different from thatdescribed, and various steps can be added, omitted, or combined. Also,features described with respect to some embodiments can be combined inother embodiments.

One aspect of the present disclosure relates to composite housings orenclosures for electronic devices, and methods of forming the same. Acomposite housing, or component of a housing, can include a pre-formedexterior or outer portion, also referred to as a shell, having a firstset of material properties; and an interior or inner portion, alsoreferred to as a core, having a second, different set of materialproperties that are independent of the first set of material properties.The pre-formed exterior portion can include a metallic material, such asstainless steel. The interior portion can include a metallic materialsuch as aluminum. The pre-formed exterior portion and the interiorportion can be welded, bonded, adhered, or otherwise joined togethersuch that they form the housing, or a portion thereof, and act as acomposite body. In some cases, the composite body can be treated asunitary body with respect to machining, manufacturing, assembly, orother processes. The pre-formed outer portion and the inner portion cantogether define an engagement feature that can mechanically engage witha moldable material positioned at a surface of the composite component,including the outer portion and the inner portion. The moldable materialcan mechanically engage the engagement feature and join or bond thecomposite housing to one or more components mounts, or enclosures.

Another aspect of the present disclosure relates to methods of formingcomponents or elements of an electronic device, such as a frame, anenclosure, a housing, and other device elements. In some examples, amethod for forming an element of a housing or enclosure can includejoining multiple bosses to an elongate member, such as a composite bodyor a unitary body. The bosses can be joined to a face of the elongatemember, for example, by welding or an adhesive, and can be mechanicallyengaged by an apparatus to position and orient the elongate member inany number of desired positions during a manufacturing or formingprocess. Features can then be formed in the elongate member by aprocess, such as machining, with the apparatus positioning the elongatemember in a desired position, via the bosses, to facilitate themachining process. For example, the elongate member can be rotated tofacilitate the machining of features such that the elongate member is ata reduced risk of damage from the machining process. In some examples,the bosses can then be removed from the elongate member, for example bymachining or cutting, to form the element. In other examples, however,the bosses can remain on the elongate member and form one or morefeatures of the elongate member.

Another aspect of the present disclosure includes an electronic devicehaving an encapsulating material at least partially surrounding adisplay component, and methods of forming the same. In some examples, anelectronic device can include a frame, an enclosure, or a housing, forexample, as described herein. The electronic device can include adisplay component and a transparent cover disposed adjacent to a majorsurface of the display component; the transparent cover at leastpartially defining an exterior surface of the electronic device. Anencapsulating material, such as a moldable polymer material, can contactand at least partially surround a periphery of the display component.Further, the encapsulating material can be positioned in an interiorvolume of the electronic device and can be directly bonded to the frameto retain the display component in the electronic device with fewer orwith no additional mounting components.

Other exemplary methods and apparatuses described herein include methodsfor forming an engagement feature on the surface of a compositecomponent including a first material and a second material. Theengagement feature can allow for the assembly of device enclosures thathave desired mechanical or chemical properties, while still providingfor the transmission of electromagnetic waves, for example as used ininductive charging or wireless communication, through the enclosure.Such methods can provide device enclosures including compositecomponents that allow for the decoupling of the material properties ofthe interior, primarily structural or functional portion of the housingfrom the exterior, primarily cosmetic portion of the housing. In someexamples, a composite component can include an inner portion joined orbonded to a pre-formed outer portion, where the materials of eachportion are independently selected. That is, the material of the innerportion can be selected in order to optimize one or more properties ofthe composite housing while the material of the exterior portion can beindependently selected to optimize one or more other desired propertiesof the housing. For example, the material and/or geometry of the innerportion can be selected in order achieve a desired level of strength,weight, stiffness, cost, thermal conductivity, electromagnetictransparency, machinability, carbon footprint, recyclability, otherproperties, or combinations thereof. Meanwhile, the material and/orgeometry of the exterior portion can be independently selected in orderto achieve any of the above properties or a desired level of hardness,corrosion resistance, scratch resistance, cosmetic finish, otherproperties, or combinations thereof.

Frames or enclosures including components formed from electricallyconductive materials can also include portions formed from insulatingmaterials, such as polymers, to allow for the transmission ofelectromagnetic waves through the enclosure. In some examples, aninsulating material can be used to join or bond two components, such asconductive components, to form the enclosure. Traditional methods offorming device enclosures from frame components can include theformation of engagement features on a surface of the component that canbe mechanically engaged by an insulating material. Such features can beformed by, for example, etching processes.

Traditional formation processes, such as traditional etching processes,are not well suited for the formation of composite components, such asone with a steel exterior and an aluminum interior. In some examples, asdescribed herein, methods are described for forming engagement featureson a surface of a composite component defined by the interior portionand the exterior portion. In some examples, such features can be formedby, for example, etching the interior portion with a process that doesnot etch the exterior portion, and etching the exterior portion with aprocess that does not etch the interior portion, thereby forming anengagement feature. The formation of such features allows for anenclosure to be formed by bonding or joining two or more compositecomponents with an insulating material, via the engagement feature, asdescribed herein.

The methods, components, and devices described herein provide for themanufacture of electronic devices including enclosures or housings thathave reduced costs, desired mechanical, chemical, or physicalproperties, and/or desired geometries. For example, methods for formingcomponents such as frame elements for electronic devices can allow forfaster production of components with reduced material waste, as comparedto traditional methods of manufacturing. Further, in some examples,methods for forming components including joining one or more bosses to amachinable member can allow for the formation of unique or desiredcomponent geometries that can be too expensive or time-consuming to formby other techniques. By utilizing bosses joined to a member tomanipulate the member during feature formation, these methods can allowfor the precise orientation of the member in any number of desiredpositions to facilitate feature formation. Whereas traditional methodsof forming features, such as by machining a stationary member, canproduce substantially more material waste and can involve longermachining times or increased wear on the machining apparatus.

It is also desirable for a display of an electronic device to occupy ordefine as much of the exterior surface of an electronic device aspossible, to provide a user with a large area to display visual contentwhile keeping the overall size of the device relatively small.Accordingly, in some examples, such as when an electronic deviceincludes a peripheral frame or enclosure, it can be desirable toposition the display close to an edge of the frame or enclosure.Traditional methods of securing displays and display components todevice frames and enclosures, however, typically include additionalsupport components that are joined to both the frame and the displaycomponent. These support components can add increased cost and assemblytime during device manufacturing, and can also increase the distancebetween the display component and the edge of the frame, resulting in areduced display area. In some examples, as described herein, anelectronic device can include a display component and an encapsulatingmaterial in contact with and at least partially surrounding a peripheryof the display component. In some examples, the encapsulating materialcan be bonded directly to the frame, enclosure, or housing of anelectronic device and positioned within an interior volume of thedevice. In other examples, the encapsulating material can be a polymermaterial, such as an epoxy or resin. While traditional mounting orsupport components for displays are metal, by making the encapsulatingmaterial a polymer, it can provide for increased shock absorption andimpact resistance relative to a metal support components, therebyprotecting the display from mechanical stresses that can be experiencedby the device. For example, during a drop event, the encapsulatingmaterial can reduce the amount of mechanical stress experience by thedisplay component relative to a similar device including a traditionalmounting component.

According to some aspects of the present disclosure, a housing, frame,or enclosure of an electronic device can include a composite component.As described herein, a composite component can include a pre-formedexterior or outer portion, also referred to as a shell, having a firstset of material properties. The pre-formed exterior portion can includea metallic material, polymeric material, ceramic material, orcombinations thereof. The composite housing can also include an interioror inner portion, also referred to as a core, having a second, differentset of material properties that are independent of the first set ofmaterial properties. For example, the interior portion can include ametallic material, polymeric material, ceramic material, or combinationsthereof. The pre-formed exterior portion and the interior portion can bewelded, bonded, adhered, or otherwise joined together such that theyform the housing or a portion thereof and act as a composite body.

In some examples, the composite component can include one or moreengagement features formed in or on a surface defined by both theinterior portion and the exterior portion. In some examples, theseengagement features can range in size from nano- or micro-scaledfeatures to macro-scale features having dimensions on the order ormillimeters. In some examples, an engagement feature can include a shapesuch that moldable material can flow or be provided into or around theengagement feature. In some examples, the engagement feature can be suchthat upon cooling, curing, hardening, or otherwise solidifying, themoldable material mechanically engages the feature to retain themoldable material on the composite component.

In some examples, two or more composite components including engagementfeatures as described herein can be joined by a moldable material thatengages the engagement features of both composite components. In someexamples, for example, multiple composite components can thus be joinedto form a housing, enclosure, or frame of an electronic device asdescribed herein. The moldable material can include any desired materialand can, in some examples, include an electrically insulating materialor an electromagnetically transparent material. In some examples, themoldable material can serve to electrically isolate a compositecomponent from a second composite component. In some examples, themoldable material can be a polymer material, such as epoxy, resin, andother similar polymer materials.

In some examples, an engagement feature can be formed on or in a surfaceof a composite component defined by an interior portion and an exteriorportion by any number of additive or subtractive processes. In someexamples, an engagement feature formation process can form an engagementfeature on a part of the surface defined by the interior portion, butmay not form an engagement feature on the part of the surface defined bythe exterior portion. In some examples, the engagement feature formationprocess can additionally form an engagement feature on a part of thesurface defined by the exterior portion, but may not form an engagementfeature on the part of the surface defined by the interior portion. Thatis, in some examples, a process for forming an engagement feature canform the feature on only one part of the surface defined by one of theinterior or exterior portion during one stage and can form an engagementfeature on a part of the surface defined by the other portion during asecond stage.

In some examples, formation of an engagement feature can be designed toonly affect or substantially affect the material of one of the interioror exterior portions. In some examples, the part of the surface definedby one of the interior or exterior portions can be masked or otherwisetreated so that a stage of the engagement feature formation process onlyaffects or forms features on the unmasked, or untreated portion.Alternatively, an engagement feature formation process can form anengagement feature or features on a part of the surface defined by boththe interior portion and the exterior portion. That is, in someexamples, an engagement feature formation process can affect and formfeatures on or in the material of both the interior portion and theexterior portion of a composite component.

Formation of an engagement feature can include a subtractive processsuch as machining, etching, laser-based processes, cutting, grinding,and other subtractive processes. In some examples, an engagement featurecan be formed by an additive process, such as a deposition process, aspraying process, a 3D printing process, and other similar additiveprocesses. Alternatively, multiple processes can be used to form theengagement feature or features.

In some examples, a method of forming a component for an electronicdevice can include joining one or more bosses to a member. The membercan be a composite body including one or more materials that canoptionally have been subjected to processing or treatment prior tojoining the one or more bosses. For example, the member can be acomposite piece including two or more materials, such as polymermaterials, ceramic materials, metal materials, or combinations thereof.Alternatively, however, the member can include two or more portions thathave been joined or bonded together to form a composite body. Forexample, the member can be a composite body as described herein, havingan exterior portion including a first material and an interior portionincluding a second, independently selected material. Further, in someexamples, one or more features can be formed in the member prior to orat the same time the bosses are joined to the member.

In some examples, a composite member can include a pre-formed exterioror outer portion, also referred to as a shell, having a first set ofmaterial properties. The pre-formed exterior portion can include ametallic material, such as stainless steel. The composite member canalso include an interior or inner portion, referred to as a core, havinga second, different set of material properties that are independent ofthe first set of material properties. For example, the interior portioncan include a metallic material such as aluminum. The pre-formedexterior portion and the interior portion can be welded, bonded,adhered, or otherwise joined together such that they form the member andact as a composite body.

In some examples, the interior or inner portion of the composite membercan include any material that has a desired material property orproperties and can be welded, bonded, adhered, or otherwise joined to anexterior portion. For example, the interior portion can include organicmaterials such as polymeric materials, ceramic materials, metallicmaterials, or combinations thereof. In some examples, the interiorportion can include a metallic material such as aluminum, copper, steel,or alloys or combinations thereof. In some examples, the interiorportion can include a metallic material having a foamed structure or abulk metallic glass. In some examples, the interior portion can itselfbe a composite material, such as a carbon reinforced polymer material,ceramic reinforced polymer material, a metal matrix composite material,a ceramic matrix composite material, or other composite materials. Theinterior portion can have any desired thickness. For example, theinterior portion of the composite member can have a thickness of severalmillimeters. In other examples, however, the interior portion of thecomposite member can have a thickness such that it extends substantiallyentirely across an entire width of the electronic device.

In some examples, the exterior or outer portion of the composite membercan include any material that has a desired material property orproperties and can be welded, bonded, adhered, or otherwise joined to aninterior portion. For example, the exterior portion can include organicmaterials such as polymeric materials, ceramic materials, metallicmaterials, or combinations thereof. In some examples, the exteriorportion can include a metallic material such as steel, titanium, oralloys or combinations thereof. In other examples, the exterior portioncan include precious or semi-precious metals such as silver, gold,platinum, or alloys or combinations thereof. Alternatively, the exteriorportion can include ceramic materials, such as alumina or sapphire,zirconia, carbides, nitrides, borides, oxides, or combinations thereof.The exterior portion can further include a metallic material such as abulk metallic glass. In some examples, the exterior portion can itselfbe a composite material, such as a carbon reinforced polymer material,ceramic reinforced polymer material, a metal matrix composite material,a ceramic matrix composite material, or other composite materials.

The exterior portion of the composite member can be a pre-formed orstandalone article prior to being joined to the inner portion. That is,in some examples, the material of the exterior portion can be a unitarybody, such as a blank, bar, strip, or piece of material. In otherexamples, however, the exterior portion can be formed from multiplebodies that are joined to the interior portion to form the compositemember. In some examples, the exterior portion is not a coating and isnot grown, deposited, coated, or otherwise formed on the interiorportion. The exterior portion of the composite member can have athickness of greater than about 25 microns, greater than about 50microns, greater than about 100 microns, 200 microns, 300 microns, 400microns, 500 microns, or greater. In some examples, the exterior portioncan have a thickness of up to about 1 millimeter, up to about 2millimeters, or up to about 5 millimeters or more. Further, in someexamples, the exterior portion can have a thickness that varies alongone or more positions of the exterior portion.

The exterior portion and interior portion of the composite member can bejoined by any methods now known in the art or that can be developed inthe future. In some examples, the exterior portion can be joineddirectly to the interior portion, such that a surface of the exteriorportion directly contacts, abuts, is fused to, is bonded to, orotherwise is directly joined to the interior portion. The exteriorportion can be joined to the interior portion by welding, for exampleultrasonic welding or laser welding, brazing, diffusion bonding, fusing,adhering, or other similar methods. In some instances, the exteriorportion can form a metallurgical bond with the interior portion along atleast a portion of the interface between the exterior and interiorportions.

In some examples, the exterior and interior are secured together withthe use of an adhesive or other material. For example, the exterior andinterior portions can be joined or secured together by a glue oradhesive, such as a resin or epoxy, by a heat activated film, by aninjection molded plastic, or other similar adhesives. In some examples,the exterior and interior portions can alternatively or additionally bejoined together via mechanical engagement between the portions. Forexample, features of the exterior portion can mechanically engagefeatures of the interior portion to mechanically join the portionstogether. These engagement features can range in size from nano- ormicro-scaled features to macro-scale features having dimensions on theorder of millimeters, and various combinations thereof.

In some examples, the interior portion can be formed into or onto theexterior portion such that a mechanical, metallurgical, other type ofbond, or combinations thereof, joins the exterior and interior portions.For example, the interior portion can be cast, molded, such as by metalinjection molding, or otherwise formed into the pre-formed exteriorportion. In this way, the material of the interior portion can flow intofeatures on the surface of the exterior portion such that when thematerial of the interior portion solidifies, for example by cooling orcuring, a mechanical, metallurgical, or other type of bond is formedbetween the interior and exterior portions.

In some examples, the composite elongate member can include featuresformed thereon, or therein, prior to joining one or more bosses to themember. For example, the member can be subjected to treatment orprocessing to define a substantially flat surface that one or morebosses can be joined to. Further, a surface of the member to which aboss or bosses can be joined can be subject to treatment, for example anetching or cleaning process, to facilitate the joining process. Themember can have any desired shape or size, although in some examples,the composite member can be an elongate member, having a length that isgreater than a width or height of the member. In some examples, themember can have a length of up to about 1 centimeter, about 2centimeters, about 3 centimeters, about 5 centimeters, about 10centimeters, about 20 centimeters, about 30 centimeters, or about 50centimeters or more. In some examples, the member can have a heightand/or width from 1 millimeter or less up to 50 centimeters, or evenlarger.

In some examples, the member can have a substantially uniformcross-section along its length, although in some other examples thecross-section of the member can vary along its length. The member canhave a cross-section of any shape, or shapes. In some examples, themember can have a substantially rectangular or square cross section, ora round cross-section. In some embodiments, the member can have across-sectional shape that is substantially rectangular, with one ormore of the sides of the rectangle having a curved shape

The boss or bosses can be joined to the member, either temporarily orpermanently, as desired. In some examples, any method or process can beused to join a boss to the member. A boss can be joined to a surface ofthe member by any method now known in the art, or that can be developedin the future. In some examples, a boss can be joined directly to themember, such that a surface of the boss directly contacts, abuts, isfused to, is bonded to, or is otherwise directly joined to the member.In some examples, the boss can be joined to the member by welding, forexample ultrasonic welding or laser welding, brazing, diffusion bonding,fusing, adhering, or other similar joining methods. In some instances,the boss can form a metallurgical bond with the member along at least aportion of the interface between the boss and the member.

In some examples, a boss and the member can be joined together with theuse of an adhesive or another joining material. For example, in someexamples, the boss and the member can be joined by a glue or adhesive,such as a resin or epoxy, by a heat activated film, by an injectionmolded plastic, and other similar adhesives. In some examples, the bossand member can alternatively or additionally be joined together viamechanical engagement between the boss and member. For example, featuresof the boss can mechanically engage features of the member tomechanically join the boss and member together. In some examples, theseengagement features can range in size from nano- or micro-scaledfeatures to macro-scale features having dimensions on the order ormillimeters.

The boss or bosses can have any size or shape as desired. Further, wheretwo or more bosses are joined to a member, the bosses can havesubstantially similar shapes, or the bosses can have a variety ofshapes. In some examples, a height and/or width of a boss can besubstantially similar to a height and/or width of the member. In someexamples, a boss can have a substantially rectangular prismatic shape.In other examples, a boss can have a substantially rectangular prismaticshape with one or more edges of the rectangular prism being chamfered.The boss or bosses can be joined to the member at any desired location.In some examples, multiple bosses can be joined to a single surface ofthe member, although in other examples, bosses can be joined to multipledifferent surfaces of the member. The position of the boss or bosses inrelation to the member can depend on the feature or features beingformed in the member, the forming processes being used, and/or thepositioning apparatus being used.

Further, the shape and size of the boss or bosses can depend on thefeature or features being formed in the member, the forming processesbeing used, and/or the positioning apparatus being used. In someexamples, the boss or bosses themselves can be, or can be formed into, afeature on the member. In such instances, the size, shape, and positionof the boss or bosses can be determined by the desired feature to beformed. In some examples, a boss can include one or more features, forexample, to engage a positioning apparatus. The shape of the boss itselfcan also depend on the positioning apparatus being used, and can beshaped to facilitate engagement with the apparatus.

The member can be formed into a frame, an enclosure, or a housing for anelectronic device, or a component thereof. For example, as describedherein, an enclosure for an electronic device can include multiplecomponents that are joined together to form the enclosure. Accordingly,in some examples, the member can be formed into a component of such anenclosure. Thus, the formed component or element can be a framecomponent or element, a housing component or element, or an enclosurecomponent or element. In some examples, however, the member can beformed into any component for an electronic device, including structuralcomponents, internal components, buttons, input components, and othersimilar components.

Once the boss or bosses have been joined to the member, they can beengaged by a positioning apparatus, to thereby support, position, and/ororient the member. In some examples, the positioning apparatus canmechanically support the member via the engaged boss or bosses. In otherexamples, a positioning apparatus can mechanically engage a boss,thereby supporting and positioning the member. In some examples, apositioning apparatus can engage a boss in alternative or additionalways, for example, by magnetically engaging with the boss, by adheringto the boss with an adhesive or glue, by electrostatic adhesion, or byany other method now known in the art or developed in the future. Forexample, the member can be rotated and/or translated about anycombination of an x-axis, y-axis, and/or z-axis to achieve a desiredorientation during the formation process, independently, simultaneously,or substantially simultaneously.

The positioning apparatus can mechanically engage the boss or bosses,for example, by grabbing, clamping, or engaging with one or moreengagement features of a boss. In some examples, the positioningapparatus can additionally or alternatively engage a boss by otherforms, for example, magnetic engagement, gluing, adhesives, welding, andother engagement methodologies. In some examples, a feature can beformed in the frame member, for example, while the positioning apparatusis supporting the member via one or more bosses. In some examples, afeature can be formed by an additive manufacturing process, asubtractive manufacturing process, or combinations thereof. For example,a feature can be formed in the member by a subtractive process such asmachining, etching, laser-based processes, cutting, grinding, and othersubtractive processes. In other examples, a feature can be formed in oron the member by an additive process, such as a deposition process, a 3Dprinting process, and similar additive processes. In yet other examples,multiple processes can be used to form a feature or features in themember. Further, multiple features can be formed in or on the member.

In some examples, one or more of the bosses that were joined to themember can be removed from the member, such as, for example, to form theelement or component. In some instances, a boss can be completelyremoved from the member so that substantially no material from the bossremains joined or adhered to the member. In other examples, however,only a portion of a boss can be removed from the member, while someother portion or amount of material from the boss remains joined oradhered to the member. A boss or a portion of a boss can be removed byany desired process. For example, a boss or a portion of a boss can beremoved from the member by processes such as machining, etching,laser-based processes, cutting, grinding, and similar processes. In someexamples where material is removed from the boss and at least a portionof boss material remains joined to the member, removing such materialcan form one or more features on the frame member. For example, a bosscan be joined to the member at a desired position and material cansubsequently be removed from the boss to form a protruding feature onthe member out of the joined boss material.

The member, including the features formed on or in the member, can besubjected to further processing or treatment after removing a boss orbosses. For example, the formed element or component can be subjected tosurface treatment processes, further additive or subtractivemanufacturing processes, or assembly processes to form a component or anelectronic device, as described herein.

According to some aspects of the present disclosure, an electronicdevice can include a frame, an enclosure, or a housing at leastpartially defining an interior volume and an exterior surface of theelectronic device. In some examples, the electronic device can includeone or more display components and a transparent cover disposed adjacentto a major surface of the one or more display components and at leastpartially defining an exterior surface of the electronic device.Additionally, the device can include an encapsulating material that atleast partially surrounds one or more of the display components andbonds directly to the frame, enclosure, or housing. In some examples,the encapsulating material can be positioned within the interior volumeof the electronic device.

In some examples, the display and/or display components can becomponents for an LCD display, an LED display, an OLED display, a plasmadisplay, a quantum dot display, or any other type of display known inthe art or developed in the future. In some examples, the transparentcover can include any type of transparent material and can be, forexample, glass, plastic or polymer material, or ceramic material such assapphire. In some examples, the encapsulating material can be any formof desirable moldable material. For example, the encapsulating materialcan include a polymer material, such as an epoxy or resin. In someexamples, the encapsulating material can be a composite material, suchas a ceramic or glass reinforced polymer material. Alternatively, themoldable material can be a curable material, or a material that can beheated to a moldable form and then cooled to a solid form.

In some examples, the encapsulating material can at least partiallysurround the periphery of a display or display component. For example,where a display or display component can be substantially rectangular,the encapsulating material can at least partially surround, one, two,three, or all of the display or display components. The encapsulatingmaterial can surround substantially the entire periphery of a display ordisplay component. Alternatively, the encapsulating material can atleast partially surround a major surface of the display or displaycomponent. For example, the encapsulating material can at leastpartially surround the bottom major surface of a display component.

In some examples, the encapsulating material can be joined or bondeddirectly to the frame, housing, or enclosure of the electronic device.The encapsulating material can be joined to the frame, housing, orenclosure by any method known in the art or discovered in the future.For example, the encapsulating material can mechanically engage afeature on the frame, housing, or enclosure. In some examples, theencapsulating material can be joined by a chemical bond to the materialof the frame, housing, or enclosure. In other examples, an adhesive canbe used to join the encapsulating material to the frame, housing, orenclosure. Even though the encapsulating material may not directlycontact the material of the frame, housing, or enclosure, the joining ofthe encapsulating material to the frame, housing, or enclosure with anadhesive is still considered to be direct bonding, as used herein.Alternatively, the encapsulating material itself can be or include anadhesive and can thus directly adhere to the frame, the housing, or theenclosure.

In some examples, the joined encapsulating material can physicallysupport and/or retain the display or display components in a desiredposition in the electronic device. The encapsulating material can haveshock absorbing properties, and can have a desired amount offlexibility, compressibility, or pliability so as to inhibit mechanicalstresses that can be experienced by the frame, housing, or enclosurefrom extending to the display. Accordingly, the display can bepositioned substantially closer to an edge of the frame, housing, orenclosure than in instances where traditional components are used toretain the display in the device. For example, the display can bepositioned within about 1 millimeters, about 2 millimeters, about 3millimeters, about 5 millimeters, or about 10 millimeters of an exteriorsurface of the display. In some examples, the display can be positionedsuch that the transparent cover can be substantially adjacent to theframe, housing, or enclosure.

In some examples, methods of forming an electronic device can include atleast partially surrounding a display component with an encapsulatingmaterial, such as the encapsulating material described above. Theencapsulating material can be provided to the display component in amoldable form to at least partially surround the display component. Insome examples, the encapsulating material can be joined to the frame,housing, or enclosure while in a moldable form. In other examples,however, the encapsulating material can be hardened, cured, cooled, orotherwise solidified around the display component and then joined to theframe, housing, or enclosure. In some examples, the transparent covercan be positioned adjacent to a major surface of the display componentprior to encapsulation. Alternatively, however, the transparent covercan be positioned adjacent to a major surface of the display componentafter the display component has been encapsulated, or even after thedisplay component has be retained, by joining the encapsulating materialto the frame, housing, or enclosure.

These and other embodiments are discussed below with reference to FIGS.1-20. The detailed description given herein with respect to thesefigures, however, is for explanatory purposes only and should not beconstrued as limiting.

FIG. 1 illustrates a perspective view of an embodiment of an electronicdevice 100. The electronic device 100 shown in FIG. 1 is a mobilewireless communication device (a smartphone, for example). Thesmartphone of FIG. 1 is merely one representative example of a devicethat can be used in conjunction with the systems and methods disclosedherein. Electronic device 100 can correspond to any form of wearableelectronic device, a portable media player, a media storage device, aportable digital assistant (“PDA”), a tablet computer, a computer, amobile communication device, a GPS unit, a remote control device, orother electronic device.

The electronic device 100 can be referred to as an electronic device ora consumer device.

The electronic device 100 can have a housing that includes a band or aframe 102 that defines an outer perimeter of the electronic device 100.The band 102, or portions thereof, can be or include a compositecomponent, as described herein. In some examples, the band 102 caninclude several sidewall components, such as a first sidewall component104, a second sidewall component 106, a third sidewall component 108(opposite the first sidewall component 104), and a fourth sidewallcomponent (not shown in FIG. 1). The aforementioned sidewall componentscan be or include a composite component, as described herein.

In some instances, some of the sidewall components form part of anantenna assembly (not shown in FIG. 1). As a result, a non-metalmaterial, or materials, can separate the sidewall components of the band102 from each other in order to electrically isolate the sidewallcomponents. For example, a first separating material 112 separates thefirst sidewall component 104 from the second sidewall component 106, anda second separating material 114 separates the second sidewall component106 from the third sidewall component 108. The aforementioned materialscan include an electrically inert, or insulating, material(s), such asplastics and/or resin, as non-limiting examples.

The electronic device 100 can further include a display assembly 116(shown as a dotted line) that is covered by a protective cover 118. Thedisplay assembly 116 can include multiple layers (discussed below), witheach layer providing a unique function. The display assembly 116 can bepartially covered by a border 120, or frame, that extends along an outeredge of the protective cover 118 and partially covers an outer edge ofthe display assembly 116. The border 120 can be positioned to hide orobscure any electrical and mechanical connections between the layers ofthe display assembly 116 and flexible circuit connectors. Also, theborder 120 can exhibit a uniform thickness. For example, the border 120can include a thickness that generally does not change in the X- andY-dimensions.

Also, as shown in FIG. 1, the display assembly 116 can include a notch122, representing an absence of the display assembly 116. The notch 122can allow for a vision system (discussed below) that provides theelectronic device 100 with information for object recognition, such asfacial recognition. In this regard, the electronic device 100 caninclude a masking layer with openings (shown as dotted lines) designedto hide or obscure the vision system, while the openings allow thevision system to provide the object recognition information. This willbe further discussed below. Also, the protective cover 118 can be formedfrom a transparent material, such as glass, plastic, sapphire, orsimilar transparent materials. In this regard, the protective cover 118can be referred to as a transparent cover, a transparent protectivecover, or a cover glass (when the protective cover 118 includes glass).As shown in FIG. 1, the protective cover 118 includes an opening 124,which can represent a single opening of the protective cover 118. Theopening 124 can allow for transmission of acoustical energy (in the formof audible sound) into the electronic device 100, which can be receivedby a microphone (not shown in FIG. 1) of the electronic device 100.Further, the opening 124 can allow for transmission of acoustical energy(in the form of audible sound) out the electronic device 100, which canbe generated by an audio module (not shown in FIG. 1) of the electronicdevice 100. Also, the electronic device 100 may not include, accordingto some embodiments, a button, such as “home button,” commonly found inelectronic devices.

The electronic device 100 can further include a port 126 designed toreceive a connector of a cable assembly. The port 126 allows theelectronic device 100 to communication data information (send andreceive), and also allows the electronic device 100 to receiveelectrical energy to charge a battery assembly. Accordingly, the port126 can include terminals that electrically couple to the connector.

Furthermore, the electronic device 100 can include several openings. Forexample, the electronic device 100 can include openings 128 that allowan additional audio module (not shown in FIG. 1) of the electronicdevice to emit acoustical energy out of the electronic device 100. Theelectronic device 100 can further include openings 132 that allow amicrophone of the electronic device to receive acoustical energy. Theelectronic device 100 can also include a first fastener 134 and a secondfastener 136 designed to be fastened to a rail that is coupled to theprotective cover 118. In this way, the first fastener 134 and the secondfastener 136 can be designed to couple the protective cover 118 with theband 102.

The electronic device 100 can include several control inputs designed toprovide a command to the electronic device 100. For example, theelectronic device 100 can include a first control input 142 and a secondcontrol input 144. The aforementioned control inputs can be used toadjust the visual information presented on the display assembly 116 orthe volume of acoustical energy output by an audio module, asnon-limiting examples. The controls can include one of a switch, asensor, or a button designed to generate a command to a processorcircuit. The control inputs can at least partially extend throughopenings in the sidewall components. For example, the second sidewallcomponent 106 can include an opening 146 that receives the first controlinput 142. Further details of an exemplary electronic device areprovided below with reference to FIG. 2.

FIG. 2 illustrates an exploded view of an electronic device 200. Theelectronic device 200 shown in FIG. 2 is a smartphone, but is merely onerepresentative example of a device that can include or be used with thesystems and methods described herein. As described with respect toelectronic device 100, electronic device 200 can also correspond to anyform of wearable electronic device, a portable media player, a mediastorage device, a portable digital assistant (“PDA”), a tablet computer,a computer, a mobile communication device, a GPS unit, a remote controldevice, and other electronic devices. In some examples, the electronicdevice 200 can include some or all of the features described herein,with respect to electronic device 100.

The electronic device 200 can have a housing that includes a band 202that at least partially defines an exterior portion, such as an outerperimeter of the electronic device. As with the band 102 described abovein FIG. 1, the band 202 can include several sidewall components, such asa first sidewall component 204, a second sidewall component 206, a thirdsidewall component 208 (opposite the first sidewall component 204), anda fourth sidewall component 210. The aforementioned sidewall componentscan be or can include a composite component, as described herein. Theband 202 can also include a non-metal material or materials thatseparate and/or join the sidewall components of the band 202 with eachother, as described herein. For example, separating material 214 canseparate and/or join the second sidewall component 206 with the thirdsidewall component 208.

The housing, including the band 202, can include one or more features toreceive or couple to other components of the device 200, such as feature222. For example, the band 202 can include any number of features suchas apertures, cavities, indentations, and other mating featuresconfigured to receive and/or attach to one or more components of thedevice 200. The electronic device 200 can include internal componentssuch as processors, memory, circuit boards, batteries, and sensors. Suchcomponents can be disposed within an internal volume defined, at leastpartially, by the band 202, and can be affixed to the band 202, viainternal surfaces, attachment features such as feature 222, threadedconnectors, studs, posts, and/or other fixing features, that are formedinto, defined by, or otherwise part of the band 202.

The device 200 can include internal components, such as a system inpackage (SiP) 226, including one or more integrated circuits such as aprocessors, sensors, and memory. The device 200 can also include abattery 224 housed in the internal volume of the device 200. The device200 can also include one or more sensors, such as optical or othersensors, that can sense or otherwise detect information regarding theenvironment exterior to the internal volume of the device 200.Additional components, such as a haptic engine, can also be included inthe device 200. The electronic device 200 can also include a displayassembly 216, similar to display assembly 116 described herein. In someexamples, the display assembly 216 can be received by and/or attached tothe band 202 by one or more attachment features.

The electronic device 200 can further include a chassis 220 that canprovide structural support. The chassis 220 can include a rigidmaterial, such as a metal, or can include a composite construction, asdescribed herein. The chassis 220 can also be coupled to the band 202.In this manner, the chassis 220 can provide an electrical grounding pathfor components electrically coupled to the chassis. The electronicdevice can alternatively or additionally include a back plate 230 havingcladding layers and/or other attachment features such that one or morecomponents of the electronic device 200 can be attached to the backplate 230, for example via welding. The back plate 230 can formconductive pathways for connecting components of the electronic device200. In some examples, the back plate 230 can be attached to the band202 of the device 200 by one or more attachment features, such asfeature 222.

An exterior surface of the electronic device 200 can further be definedby a back cover 240 that can be coupled with the band 202. In thisregard, the back cover 240 can combine with the band 202 to form anenclosure or a housing of the electronic device 200, with the enclosureor housing (including band 202 and back cover 240) at least partiallydefining an internal volume. The back cover 240 can include atransparent material, such as glass, plastic, sapphire, or anothertransparent material.

The housing, including the band 202 of one or more composite componentscan be conformable to interior dimensional requirements, as defined bythe internal components. For example, the structure of the housingincluding a composite band 202 can be defined or limited exclusively orprimarily by the internal components the housing is designed toaccommodate. That is, because a housing including a composite band 202can be extremely light and strong, the housing can be shaped to housethe interior components in a dimensionally efficient manner withoutbeing constrained by factors other than the dimensions of thecomponents, such as the need for additional structural elements. Thecomposite components 204, 206, 208, 210 of the band can be formed by avariety of processes, as discussed herein. In some embodiments, theseformation processes can allow for the housing and/or band 202 to have adetailed shape or design that is tailored specifically to satisfy one ormore needs, such as internal dimensional requirements, without the needfor additional features to reinforce the structure of the housing.Additionally, artifacts of the manufacturing process of the housing canbe eliminated. Furthermore, other components of the electronic device200, such as individual internal structural components like the chassis220 or exterior input components, can be formed from or can include acomposite component, as described herein.

While any number or variety of components of an electronic device, forexample electronic device 200, can be formed from or can include acomposite component, the structure of these composite components can be,for example, a composite component including an exterior portion joinedto an interior portion as described herein. The structure and materialsof the exterior and interior portion, as well as the composite componentitself, can apply not only to the specific examples discussed herein,but to any number or variety of embodiments in any combination. Variousembodiments of composite components are described below with referenceto FIG. 3.

FIG. 3 shows an exploded view of a band 302 of a housing or enclosure ofan electronic device, for example electronic device 100 or electronicdevice 200 described with respect to FIGS. 1 and 2. The band 302 caninclude one or more portions that are composite components or thatinclude composite components, such as an exterior portion joined to aninterior portion, as described herein. For example, the band 302 caninclude a first composite sidewall component 306, a second compositesidewall component 308, a third composite sidewall component 310(opposite the first composite sidewall component 306), and a fourthcomposite sidewall component 312. In some examples, and as describedherein, the composite components 306, 308, 310, 312 can be separatedand/or joined together by a material 314 that can include anelectrically inert, or insulating, material(s), such as plastics and/orresin, as non-limiting examples.

Although the embodiment illustrated in FIG. 3 includes a band 302 havingmultiple composite sidewall components 306, 308, 310, 312 that arejoined together, in some examples a housing or enclosure for anelectronic device can include or be formed form a single compositecomponent having an interior and exterior portion as described herein.Further, in some examples the composite components can form portions ofthe housing or enclosure other than the sidewalls, such as a topportion, bottom portion, or any portion of the housing or enclosure.Further details of the composite sidewall components 306, 308, 310, 312are provided below with reference to FIGS. 4A-8.

FIG. 4A shows a perspective view of a composite component 400 includingan outer or exterior portion 402 and an inner or interior portion 404.Although illustrated in an exploded view, the composite component 400can include an outer or exterior portion 402 that is joined or bonded tothe inner or interior portion 404. In some examples, the exteriorportion 402 can be pre-formed and can include a metallic material, suchas stainless steel, although other materials are expressly contemplated,as described herein. In some examples, the exterior portion can have athickness greater than about 25 microns. The interior portion 404 canhave a second, different set of material properties that are independentof the first set of material properties of the outer portion 402. Insome examples, the exterior portion 402 and the interior portion 404 canbe welded, bonded, adhered, or otherwise joined together such that theyform the housing, or a portion thereof, and act as a composite body 400.That is, in some cases, the composite body 400 can be treated as asingle piece of material with any process, such as the processesdescribed herein, including manufacturing and assembly processes. Theexterior portion 402 and the interior portion 404 can include anydesired shape or design, and thus the component 400 can include anydesired shape or design. In some examples, the component 400 can be aportion of a housing of an electronic device. In some other examples,however, the component 400 can be any component of an electronic device,such as a structural component, an internal component, an externalcomponent, and any other component.

FIG. 4B shows a perspective view of a simplified composite component400, for example, as shown in FIG. 4A, including features 412 and 414formed in and at least partially defined by the interior portion 404.The features 412, 414 can include protruding features, recessedfeatures, or combinations thereof. In some examples, a feature, such asfeature 412, can be formed by an additive manufacturing process. In someexamples, a feature, such as feature 414, can be formed by a subtractivemanufacturing process. In some examples, a feature can include anaperture, a recess, a blind hole, a cavity, a protrusion, orcombinations thereof. A feature 412, 414 can be an attachment featurefor one or more other components of an electronic device. The component400 and concepts illustrated in FIGS. 4A and 4B can be applied to any ofthe composite components described herein, in any combination. Further,examples including the concepts and features discussed with respect toFIGS. 4A and 4B are described below with reference to FIGS. 5-8.

FIG. 5 shows a composite component 510 that can be similar to or includethe features of the composite sidewall components 304, 306, 308, 310described with respect to FIG. 3 and component 400 described withrespect to FIGS. 4A-4B. The composite component 510 can include an outeror exterior portion 522 that is joined to an inner or interior portion524. In the present example, the exterior portion 522 can at leastpartially define an exterior surface of a housing or enclosure of anelectronic device. The interior portion 524 can at least partiallydefine a surface of an internal volume of the electronic device. As canbe seen in FIG. 5, the composite component 510 can include a number offeatures 532, 534, 536, that can, for example, act as attachmentfeatures for other components of an electronic device.

In some examples, the features can be formed in one or both of theexterior portion 522 and the interior portion 524 of the compositecomponent 510. For example, the interior portion 524 of the compositecomponent 510 can include a feature, such as aperture 532. In someexamples, the feature 532 can be an aperture, a recess, a blind hole, orother feature formed in the interior portion 524 by a subtractiveprocess, such as a machining or an etching process. In some examples,the feature 532 can act as an attachment feature for other components ofthe electronic device. The feature 532 can be configured to receivecomponents of an electronic device, such as buttons or input components.Although depicted as an aperture 532, the feature 532 can take anydesired form or shape. In some examples, the feature 532 can extend, atleast partially, into the interior portion 524 to a desired depth.Alternatively, however, the feature 532 can extend substantiallyentirely through an entire thickness of interior portion 524.

In some examples, a feature can be formed in both the exterior portion522 and the interior portion 524 of the composite component 510. Forexample, feature 534 can be formed in, or be defined by, both theexterior and the interior portions 522, 524 of the component 510.Feature 534 can be an aperture or a through hole that passes at leastpartially through the exterior portion 522 and the interior portion 524.Further, although the portions 522, 524 are illustrated as having arelatively uniform thickness, in some examples, the thickness of theexterior portion 522 and/or interior portion 524 can vary at locationswhere features, such as feature 534, are formed. A protruding feature,such as feature 536, can be formed in the interior portion 524, forexample, by a machining process or an additive manufacturing process,and can serve as an attachment feature for other components of anelectronic device. Although depicted as a protrusion defining anaperture therethrough, the feature 536 can include any desired shape ordesign.

As described herein, the interior portion 524 of the composite component510 can be selected such that it has a set of material properties thatare desirable for the formation of features, such as features 532, 534,536. For example, the material of the interior portion 524 can beselected to have a material property or set of material properties thatallow for the interior portion 524 to be highly machinable withoutcausing high levels of wear on machining tools. Additionally, thematerial of the interior portion 524 can be relatively inexpensive sothat waste material produced by forming the features does notsubstantially increase production costs. Further, as described herein,the material of the exterior portion can be selected to have a materialproperty or set of material properties, independent of the materialproperties of the interior portion, that allow the exterior portion 522to have, for example, high levels of hardness and corrosion resistance.

In some examples, the features formed in one or both of exterior portion522 and interior portion 524, such as features 532, 534, 536, can have amajor dimension from about a micron up to about a millimeter, or severalmillimeters or more. In some cases, a feature, such as feature 536 canhave a major dimension from about 100 microns to about 1 millimeter.Further, in some examples, a feature, such as feature 536, can haveminor dimensions from about 100 microns to about 1 millimeter.

Further, as can be seen in FIG. 5, the exterior portion 522 can have asubstantially curved shape or profile that can correspond to an exteriorprofile of the electronic device. The exterior portion 522 can have anydesired shape or profile. In some examples where the exterior portionhas a substantially curved shape or profile, the interior portion 524can be positioned entirely behind or within a curve defining the curvedprofile of the exterior portion 522. Additional details of the exteriorportion 522 are provided below with reference to FIG. 6.

FIG. 6 shows another perspective view of the composite component 510 ofthe housing of FIG. 5. As can be seen in FIG. 6, one or more areas, suchas area 538, of the exterior portion 522, can be removed so that atleast some of the interior portion 524 can be exposed. The exposedsurface of the interior portion 522 can be subjected to a treatment orother processing in order to, for example, protect the exposed surfaceof the interior portion 522. In some examples, the exterior portion 522can include a stainless steel alloy and the interior portion 524 caninclude aluminum. At area 538, where the aluminum of the interiorportion 524 is externally exposed, an interface between the stainlesssteel of the exterior portion 522 and the aluminum of the interiorportion 524 can also be exposed.

In such examples, the interface between the materials of the twoportions can form a galvanic contact and one of the materials of theportions 522, 524 can be subjected or prone to galvanic corrosion.Accordingly, areas, such as area 538, where an interface between thematerials of the portions 522, 524 is exposed can be processed ortreated to prevent or inhibit galvanic corrosion. A material ormaterials can be deposited over the interface between the portions 522,524 at area 538 to prevent or inhibit galvanic corrosion. Examplematerial can include, but are in no way limited to, a polymericmaterial, a metallic material, a ceramic material, or combinationsthereof.

Alternatively, the geometry of the exterior portion 522 and/or interiorportion 524 can be designed so that an interface between the portions isnot exposed, even when features such as feature 538 are formed in theexterior portion 522. For example, the exterior portion 522 can bethicker at the area 538 where a feature is formed so that the interiorportion 524 is not exposed, even when material is removed from theexterior portion 524. The interior portion 524 can correspondingly bemade thinner at areas where the exterior portion 522 has an increasedthickness, so that the composite component 510 maintains a relativelyuniform thickness. Alternative views and features of the compositecomponent 510 are detailed below, with reference to FIGS. 7 and 8.

FIG. 7 shows a top view of the composite component 510 depicted in FIGS.5 and 6. As can be seen, the thicknesses of one or both of the exteriorportion 522 and the interior portion 524 can have a thickness thatvaries along the length of the component 510. Alternatively, however,the thickness of the exterior portion 522 and/or interior portion 524can be substantially uniform along the length of the component 510. Theexterior portion 522 can have a thickness of greater than about 25microns, greater than about 50 microns, greater than about 100 microns,200 microns, 300 microns, 400 microns, 500 microns, or greater. In someexamples, the exterior portion can have a thickness of up to about 1millimeter, up to about 2 millimeters, or up to about 5 millimeters ormore. In alternative examples, the interior portion 524 can have anydesired thickness or thicknesses. For example, as shown in FIG. 7, theinterior portion 524 can have a thickness that varies from about 100microns up to about several millimeters or more. In some instances, theinterior portion can have a thickness that approximates an entire widthof the electronic device.

FIG. 8 shows a side view of the composite component 510 depicted inFIGS. 5-7. As described herein, the interior portion 524 can include anynumber of features that are formed in the material or the interiorportion 524, or added or attached to the interior portion 524 by anydesired method or process. In some examples, the features, such asfeature 534, can serve as attachment features for components of anelectronic device, such as an internal component or structuralcomponents. Further, in some examples, the interior portion 524 can formor define a surface that at least partially defines an internal volumeof an electronic device. In some examples, the exterior portion 522 maynot form part of a surface that defines an internal volume of anelectronic device. In some instances, however, the exterior portion 522can form at least part of a surface that defines an internal volume ofan electronic device.

While any number or variety of components of an electronic device, forexample electronic device 100 or 200, can be formed from or can includea composite component, such as component 210, 310, 400, and/or 510, thestructure of these composite components can be, for example, a compositecomponent including an exterior portion joined to an interior portion,as described herein. The structure and materials of the exterior andinterior portion, as well as the composite component itself, can applynot only to the specific examples discussed herein, but to any number orvariety of embodiments in any combination. Various embodiments ofcomposite components are described below, with reference to FIGS. 9-13.

FIG. 9A shows a simplified perspective view of a composite component 600including an exterior portion 602 bonded to an interior portion 604, asdescribed herein. In some examples, the exterior portion 602 can includea metal material, although other materials are expressly contemplated,as described herein. The interior portion can include a second materialdifferent than the material of the exterior portion and including asecond set of material properties independent of the set of materialproperties of the exterior portion 602. As can be seen in FIG. 9A, theexterior portion 602 and the interior portion 604 can cooperate to atleast partially define a surface 610 that can include a feature 612. Insome examples, the feature 612 can be a recess, an aperture, a cavity,or other similar feature. In some other examples, however, the feature612 can include a protrusion or positive feature, or combinationsthereof. Such a feature 612 can be, an attachment feature for joiningthe component 600 to one or more other components for an electronicdevice.

As shown in FIG. 9B, in some examples, the surface 610 defined by boththe exterior portion 602 and the interior portion 604 can be treated orsubjected to processing to form one or more features thereon. In someexamples, the surface 610 can include one or more engagement featuresformed thereon. The surface 610 can include multiple engagement featuresformed on the part of the surface defined by the exterior portion 602,and multiple engagement features formed on the part of the surfacedefined by the interior portion 604. The engagement features can rangein size from nano- or micro-scaled features to macro-scale featureshaving dimensions on the order or millimeters. In some examples, theengagement feature can have any desired shape to engage a moldablematerial. For example, an engagement feature can include a recess, aprotrusion, or combinations thereof.

In some examples, the features can be formed by any number of additiveor subtractive processes. In some examples, an engagement featureformation process can form the engagement feature on a part of thesurface defined by the interior portion, but may not form an engagementfeature on or otherwise substantially damage or degrade the part of thesurface defined by the exterior portion 602. In some examples, thetreatment process can additionally form an engagement feature on a partof the surface defined by the exterior portion 602, but may not form anengagement feature on or otherwise substantially damage or degrade thepart of the surface defined by the interior portion 604.

The component 600 and concepts illustrated in FIGS. 9A and 9B can beapplied to any of the composite components described herein, in anycombination. Further examples including the concepts and featuresdiscussed with respect to FIGS. 9A and 9B are described below withreference to FIGS. 10-13.

FIG. 10 shows a close-up perspective view of a composite component 710that can form a housing or enclosure of an electronic device. As withthe component 410 depicted in FIG. 5-8, the component 710 can include apre-formed exterior portion 722 that is joined to an interior portion724. The exterior portion 722 can include a material or materials havinga first set of material properties, while the interior portion 724 caninclude a material or materials having a second set of materialproperties independent of the first set of material properties.

As described herein, in some examples, the exterior portion 722 can bedirectly joined, bonded, or adhered to the interior portion 724. Thatis, the exterior portion 722 can directly contact, abut, be fused orbonded, or otherwise joined to the interior portion 724. In exampleswhere the exterior portion 722 and the interior portion 724 both includemetal materials, the bond between the exterior and interior portions722, 724 can be a metallurgical bond. In other examples, the exteriorportion 722 can directly contact the interior portion 724 alongsubstantially the entire interface, or only at one or more locations.Further, even where the portions 722, 724 are in direct contact alongsubstantially the entire interface, the portions 722, 724 can, in someexamples, only be bonded or joined together at one or more locations.For example, the interior portion 724 can be welded to the exteriorportion 722 at one or more locations.

In some examples, the interior portion 724 can be joined to the exteriorportion 722 by processes such as brazing, diffusion bonding, electronbeam welding, ultrasonic welding, laser welding, adhering, for example,with an adhesive, and similar joining methods. In some examples, theportions 722, 724 can be welded together by a pulsed laser weldingprocess, such as a nanosecond pulsed laser welding process. Where awelding process is used, the welding process can be conducted along theinterface or seam between the portions 722, 724, or can be conductedthrough one or both of the portions 722, 724, at any number of desiredlocations.

As can be further seen in FIG. 10, the composite component 710 caninclude one or more features, such as feature 732, which are formed fromor defined by both the exterior portion 722 and the interior portion724. In some examples feature 732 can be an attachment feature, forexample, for one or more components of an electronic device. Feature 732can serve alternative or additional purposes and can, for example, serveto reduce the weight of the composite component 710. In some examples, afeature 732 can facilitate the joining of composite component 710 toanother composite component, such as band 102 or 202, to form a housingor an enclosure, as described herein. Feature 732 can mechanicallyengage a material, such as material 114, 214, 314 described herein, toform a band 102, 202.

FIG. 11 shows an exemplary composite component 810 that can include apre-formed exterior portion 822 joined to an interior portion 824. Thecomposite component 810 can include a surface 826 that is defined byboth the exterior portion 822 and the interior portion 824. Although thesurface 826 is depicted as including an approximately equal area definedby each portion, in some examples, one of the interior or exteriorportions 822, 824 can define substantially more of the surface 826 thanthe other portion.

The surface 826 can include one or more engagement features formedthereon. For example, the surface 826 can include multiple engagementfeatures 832 formed on the part of the surface defined by the exteriorportion 822, and multiple engagement features 834 formed on the part ofthe surface defined by the interior portion 824. As described herein,the engagement features 832, 834 can range in size from nano- ormicro-scaled features to macro-scale features having dimensions on theorder or millimeters. In some examples, the engagement feature 832, 834can have any desired shape to engage a moldable material, as describedherein. For example, an engagement feature can include a recess, aprotrusion, or combinations thereof.

In some examples, the engagement features 832, 834 can allow thecomposite component 810 to be joined to a second component by mechanicalengagement with a moldable material. For example, a moldable materialcan mechanically engage the engagement features 832, 834 to join thecomponent 810 with a component, such as component 308, illustrated anddescribed with respect to FIG. 3.

FIG. 12 illustrates a band 802 that includes component 810, as describedabove. In some examples, the component 810 can include multiple surfacesdefined by the exterior portion 822 and the interior portion 824. Forexample, component 810 can include a second surface (not shown) oppositethe surface 826 that is substantially similar and that also includesengagement features formed thereon. Further, one or more othercomponents of the band 802, such as components 804 and 808, cansimilarly include engagement features formed on a surface defined by anexterior portion and an interior portion. As shown, a moldable material814 is disposed between the composite component 810 and the components804, 808 to which it is joined. The moldable material 814 can include apolymer material, such as epoxy or resin, and can be an electricallyinsulating material. The moldable material 814 is mechanically engagedwith the engagement features 832, 834 of the composite component 810 andcan similarly be mechanically engaged with engagement features ofcomponent 804. In this way, the moldable material 814 can serve to jointhe composite component 810 to additional components 804, 808 andthereby form the band 802.

FIG. 13 illustrates an exemplary process for forming a compositecomponent for an electronic device having engagement features on asurface, as described herein. The process 900 for forming the compositecomponent can include joining a pre-formed portion, such as an exteriorportion including a first material having a first material property orset of material properties, with a second portion, such as an interiorportion including a second material having a second material property orset of material properties, at block 910. The process 900 can furtherinclude forming one or more features in at least the second portion atblock 920, and treating a surface defined by the pre-formed firstportion and the second portion to form an engagement feature thereon atblock 930.

At block 910, a pre-formed first portion, such as an exterior portion ofa composite component can be joined with a second portion, such as aninterior portion, as described herein.

The pre-formed first portion can include a first material, while thesecond portion can include a second, independently selected material. Insome examples, the materials of the first and second portions caninclude any of the materials described herein with respect to interiorand/or exterior portions of a composite component. In some examples, thepre-formed first portion can be subject to treatment or processing priorto joining, for example to form a desired profile or shape, or to formone or more features therein.

In some examples, the pre-formed first portion can be positioned or heldin a desired position, for example by a clamping device or otherapparatus, and the second portion can be brought in contact with thepre-formed first portion, whereupon the portions are joined together toform a composite body. The particular process used to join the portionscan include any of the processes discussed herein, and can be selecteddepending on the materials of the pre-formed first portion and thesecond portion. For example, joining can include directly joining thepre-formed first portion with the second portion by processes such aswelding, for example ultrasonic welding or laser welding, brazing,diffusion bonding, fusing, adhering, or other similar methods. Joiningcan include pulsed laser welding, for example nanosecond pulsed laserwelding. In some examples, joining can include mechanically engaging afeature of the pre-formed first portion with a corresponding feature ofthe second portion, as described herein.

In some examples, joining can alternatively or additionally includeproviding a layer or material between the pre-formed first portion andthe second portion to join the portions together. Thus, in someexamples, joining can include providing a material such as an adhesive,glue, heat activated film, polymer material such as epoxy or resin, orother moldable material between the pre-formed first portion and thesecond portion. This intermediate layer can be provided as a moldablematerial between the portions in at least some locations andsubsequently cured or cooled to join the portions. In some examples, theintermediate material can form a direct bond with the surface of one orboth portions, such as a chemical or metallurgical bond. In someexamples, the intermediate material can join the portions byalternatively or additionally mechanically engaging with one or morefeatures on a surface of the portions.

In some examples, the second portion can be joined with the pre-formedfirst portion by providing the second portion to the pre-formed firstportion in a moldable form and curing, cooling, or otherwise hardeningthe material of the second portion. For example, the second portion canbe cast, die cast, molded, injection molded, metal injection molded, orotherwise formed into a feature or features of the pre-formed firstportion. In some examples, the pre-formed first portion can be presentin a mold or other apparatus and the second portion can be provided intothe mold to solidify and join with the pre-formed first portion.

In some examples, providing the second portion in moldable form can jointhe pre-formed first portion and the second portion by forming a bonddirectly between the materials of the first and second portions, such asa chemical or metallurgical bond. In some examples, the portions canalternatively or additionally be joined, producing a mechanicalengagement between the material of the second portion with one or morefeatures formed in or on a surface of the first portion, such as nano-,micro-, and/or macro-scaled features. Thus, in some examples, materialof the second portion can flow or otherwise be provided into one or morefeatures of the pre-formed first portion and can be solidified tomechanically engage and join the portions.

Further, in some examples, the first portion, while described as apre-formed first portion, can be formed substantially simultaneouslywith the second portion. For example, the first and second portions canbe co-extruded or provided in moldable form so that the portions arejoined by a chemical bond, a metallurgical bond, mechanical engagement,and other joining methods.

At block 920, one or more features are formed in at least the secondportion of the composite component. The feature or features can beformed according to any of the processes or methods described herein,such as additive or subtractive manufacturing processes. For example,one or more features can be formed in at least the second portion bymachining, etching, depositing, molding, or other processes. In someexamples, the one or more features can be formed in both the pre-formedfirst portion and the second portion, as described herein.

In some examples, forming one or more features in at least the secondcomponent at block 920 can occur substantially simultaneously with thejoining step at block 910. For example, where the second portion can becast or molded into the pre-formed first portion, the one or morefeatures can be formed in the second portion during the molding orcasting process when the second portion is solidified, or otherwiseformed and joined with the first portion.

At block 930, a surface defined by the pre-formed first portion and thesecond portion can be treated to form an engagement feature on or in thesurface, as described herein. In some examples, an engagement featurecan range in size from nano- or micro-scaled features to macro-scalefeatures having dimensions on the order or millimeters. Further, in someexamples, the treatment at block 930 can form more than one engagementfeature on the surface. The treatment process can include any number ofadditive or subtractive processes. In some examples, an engagementfeature formation process can form the engagement feature on a part ofthe surface defined by the interior portion, but may not form anengagement feature on or otherwise substantially damage or degrade thepart of the surface defined by the exterior portion. In some examples,the treatment process can additionally form an engagement feature on apart of the surface defined by the exterior portion, but may not form anengagement feature on or otherwise substantially damage or degrade thepart of the surface defined by the interior portion. That is, in someexamples, the treatment at block 930 can form an engagement feature ononly a part of the surface defined by one of the interior or exteriorportion during one stage, and can form an engagement feature on a partof the surface defined by the other of the interior or exterior portionduring a second stage.

In some examples, a stage of the treatment at block 930 can affect orsubstantially affect only the material of one of the interior orexterior portions. In other examples, however, the part of the surfacedefined by one of the interior or exterior portions can be masked orotherwise treated so that a stage of the treatment only affects or formsfeatures on the unmasked, or untreated portion. In alternative examples,however, the treatment can form an engagement feature or features on apart of the surface defined by both the interior portion and theexterior portion. The treatment at block 930 can include a subtractivetreatment process or processes, such as machining, etching, laser-basedprocesses, cutting, grinding, and similar subtractive processes. In someexamples, the treatment at block 930 can include an additive process,such as a deposition process, a thermal spraying process, a 3D printingprocess, and other similar additive processes. In some examples, thetreatment at block 930 can include multiple processes to form theengagement feature or features.

In some examples, the process 900 can further include providing amoldable material, for example moldable material 814 described herein,to the surface including the engagement feature. The moldable materialcan be provided in moldable or flowable form. The process 900 canfurther include hardening, curing, cooling, or otherwise solidifying themoldable material to mechanically engage the moldable material with theformed engagement feature. The moldable material can also bemechanically engaged with one or more other components, and can serve tojoin the components together, for example, as described herein.

While any number or variety of components of an electronic device, suchas electronic device 100 or 200, can be formed from or can include acomponent, such as component 210, 310, 400, 510, 600, 710, and/or 810,the structure of these components can be, for example, a compositecomponent including an exterior portion joined to an interior portion,as described herein. The structure and materials of the exterior andinterior portion, as well as the composite component itself, can applynot only to the specific examples discussed herein, but to any number orvariety of embodiments in any combination. Various embodiments ofcomponents and methods of forming the same are described below withreference to FIGS. 14-19.

FIG. 14 illustrates a flow diagram including various stages of a methodfor forming an element or component 1002 of an electronic device. Theprocess for forming the element or component 1002 can include joining aboss 1004 to a member 1002, for example, by any desired temporary orpermanent methods. In some examples, the boss 1004 can be bonded to thecomponent 1002 by welding or an adhesive. Once bonded to the member1002, the boss 1004 can be engaged by a positioning apparatus tosupport, orient, and position the member 1002, for example, during oneor more manufacturing processes. In some examples, the positioningapparatus or other device can position the component 1002 in any numberof desired positioned, via the boss 1004, while one or more features1012, 1014, and 1016 are formed therein. As described herein, featurescan be formed by any combination of additive or subtractivemanufacturing processes. In some examples, the features 1012, 1014, and1016 can include an aperture, a recess, a blind hole, a cavity, aprotrusion, or combinations thereof. The boss 1004 can then beoptionally removed from the component 1002, however, in some examples,the boss 1004 can at least partially remain on the component 1002 andonly some material may be removed from the boss 1004. In those examples,the boss 1004 can be formed into a feature of the component 1002, asdescribed herein.

The component 1002 and concepts illustrated in FIG. 14 can be applied toany of the composite components described herein, in any combination.Further examples including the concepts and features discussed withrespect to FIG. 14 are described below, with reference to FIGS. 15-19.

FIG. 15 illustrates a process flow diagram of an exemplary process forforming an element or component for an electronic device. The process1100 for forming the element or component, such as a frame element orcomponent, can include joining a boss to a member at block 1110, forminga feature in the member while orienting the member via the boss at block1120, and at least partially removing the boss from the member to formthe element or component at block 1130.

At block 1110, a boss can be joined to a member, such as a frame member.In some examples, multiple bosses can be joined to the member. Themember can assume any desired form and, in some examples, can be acomposite member including a pre-formed first portion formed of a firstmaterial joined to a second portion formed of a second material, asdescribed herein. In some examples, the boss can be joined to the membereither temporarily or permanently, as desired, and as described herein.Any process can be used to join a boss to the member at block 1110. Insome examples, the boss can be joined directly to the member, such thata surface of the boss directly contacts, abuts, is fused to, is bondedto, or otherwise is directly joined to the member. Alternatively, theboss can be joined to the member by welding, for example ultrasonicwelding or laser welding, brazing, diffusion bonding, fusing, adhering,or other similar methods. In some instances, the boss can form ametallurgical bond with the member along at least a portion of theinterface between the boss and the member.

The boss can, according to one example, be joined to the member with theuse of an adhesive or other material. For example, the boss and membercan be joined by a glue or an adhesive, such as a resin or epoxy, by aheat activated film, by an injection molded plastic, and similar joiningmethods. In some examples, the boss and member can alternatively oradditionally be joined together via mechanical engagement between theboss and member. For example, features of the boss can mechanicallyengage features of the member to mechanically join the boss and themember together. In some examples, these engagement features can rangein size from nano- or micro-scaled features to macro-scale featureshaving dimensions on the order or millimeters. The boss can include anydesired shape or size, as described herein.

At block 1120, a feature or features are formed in the member whileorienting the member via the boss. In some examples, a positioningapparatus can mechanically or otherwise engage the boss to support,orient, and position the member at block 1120. The positioning apparatuscan position the member in any number of desired orientations via theboss or bosses. In some examples, the positioning apparatus can hold themember in one position or orientation while a feature is formed at block1120. In other examples, however, a positioning apparatus can move themember between any number of different positions and orientations whilethe feature is formed at block 1120. The feature can include any desiredshape or size, and can be any of the features described herein, such asthose illustrated in FIGS. 5-8. In some examples, the feature can beformed by an additive manufacturing process, a subtractive manufacturingprocess, or combinations thereof. For example, the feature can be formedin the member by a subtractive process such as machining, etching,laser-based processes, cutting, grinding, and similar subtractiveprocesses. Alternatively, the feature can be formed in or on the memberby an additive process, such as a deposition process, a 3D printingprocess, and other similar additive processes. In some examples,multiple processes can be used to form the feature. Furthermore,multiple features can be formed in or on the member at block 1120.

At block 1130, the boss can be at least partially removed from themember to form the component or element, such as a frame component orelement, as described herein. In some examples, substantially the entireboss can be removed from the member. In other embodiments, however, theboss can be formed into a feature itself and only the boss materialrequired to form such a feature can be removed from the member. In someexamples, the boss can be removed by any desired process, as describedherein. For example, a boss or a portion of a boss can be removed fromthe member by processes such as machining, etching, laser-basedprocesses, cutting, grinding, and other material removal processes.

In some examples, the formed element or component can be subjected toadditional processing or treatment before, during, or after any ofblocks 1110, 1120, or 1130. For example, an exterior surface of theelement or component can be treated, for example, by depositing a PVDlayer thereon, to provide a desired color or surface finish. The methodsof FIG. 15 for forming an element or component for an electronic deviceare detailed below with reference to FIGS. 16-19

FIG. 16 illustrates a member 1200 that can be, for example, a framemember. As described herein, the member 1200 can be a composite bodyincluding one or more materials that can be subjected to processing ortreatment prior to joining the one or more bosses. In some examples, themember can be a unitary piece of material, such as a polymer material,ceramic material, metal material, or combinations thereof. In someexamples, however, the member can be a composite member including apre-formed exterior portion joined to an interior portion, as describedherein. Further, as can be seen, the member 1200 can include asubstantially rounded or curved surface along at least one side.

FIG. 17 shows the member 1200 including multiple bosses 1202, 1204, 1206that have been joined to the member 1200, as described with respect toblock 1110 of process 1100. As can be seen, the bosses 1202, 1204, 1206can have a substantially rectangular prismatic shape with chamfers alongone or more edges. In some examples, the bosses 1202, 1204, 1206 can bejoined to a single surface of the member. In other examples, however,bosses 1202, 1204, 1206 can be joined to two or more different surfacesof the member 1200, as desired.

FIG. 18 illustrates the location of multiple features that can be formedin the member during a feature formation process, for example, asdescribed above with respect to block 820 of process 800. As can beseen, the final formed element or component 1210 can be produced byremoving material from the member 1200. For example, at least features1222, 1224, and 1226, which can be similar to the features describedherein with respect to FIGS. 5-8, can be formed in the member 1200. FIG.19 shows the formed element or component 1210 after the bosses 1202,1204, 1206 have at least partially been removed. In the present example,the bosses 1202 and 1206 have been substantially entirely removed fromthe member 1200. As can be seen, however, the boss 1204 has only beenpartially removed from the member 1200, with some material from the boss1204 now forming feature 1228 of the element 1210. In this way,protruding features, such as feature 1228, can be formed on the member1200 without the need to increase the dimensions of the member 1200along its entire length, height or width.

While any number or variety of components of an electronic device, forexample electronic device 100 or 200, can be formed from or can includea component, such as component 210, 310, 400, 510, 600, 710, 810, 1000,and/or 1110, the structure of these components can be, for example, acomposite component including an exterior portion joined to an interiorportion, as described herein. The structure and materials of theexterior and interior portion, as well as the composite componentitself, can apply not only to the specific examples discussed herein,but to any number or variety of embodiments in any combination. Variousembodiments of components, electronic devices, and methods of formingthe same are described below with reference to FIGS. 20-24.

FIG. 20 illustrates a diagrammatic flow diagram including various stagesof a method of forming an electronic device 1300. The process forforming the device 1300 can include at least partially surrounding aperiphery of a display component 1304 with a moldable encapsulatingmaterial 1306, positioning a transparent cover 1302 adjacent to a majorsurface of the display component 1304, and joining the display component1304 and transparent cover 1302 to the frame 1310 of the device 1300 bythe moldable encapsulating material 1306.

In some examples, an encapsulating material 1306 can be provided to adisplay component 1304 in a moldable form to at least partially surroundthe display component 1304. In some examples, the encapsulating material1306 can at least partially surround, one, two, three, or all of thesides of the display or display component 1304. The encapsulatingmaterial 1306 can be any desirable form of moldable material. Forexample, the encapsulating material 1306 can include a polymer material,such as an epoxy or resin. In other examples, the encapsulating material1306 can be a composite material, such as a ceramic or glass reinforcedpolymer material. Alternatively, the moldable material 1306 can be acurable material, or can be heated to a moldable form, and then cooledto solidify.

The encapsulating material can serve to join or bond the displaycomponent to the frame, and thereby retain the display within thehousing of the device. In some examples, the display component 1304 andencapsulating material 1306 can be bonded to one or more surfaces of thedevice 1300, such as support surface 1312. Further, in some examples,the encapsulating material 1306 can be disposed entirely within aninternal volume of the device 1300. In some examples, the encapsulatingmaterial 1306 can be bonded or joined to the frame 1310 by an adhesivethat can securely bond the encapsulating material and display componentto the frame. In some examples, however, the moldable encapsulatingmaterial 1306 itself can directly bond to the frame 1310.

The device 1300 and concepts illustrated in FIG. 20 can be applied toany of the components and device described herein, in any combination.Further examples including the concepts and features discussed withrespect to FIG. 20 are described below with reference to FIGS. 21-24.

FIG. 21 shows an exploded view of an electronic device 1400 includingvarious components. The electronic device 1400 can be substantiallysimilar to electronic devices 100 and 200 described herein, with respectto FIGS. 1 and 2. The device 1400 can include a housing that has a bandor a frame 1402, which can again be substantially similar to other bandsdescribed herein, for example with respect to FIGS. 1 and 2. In someexamples, the band can include multiple components 1404, 1406, 1408, and1410, such as composite components, that are joined by a moldablematerial 1414 to form the band 1402. The device can include a display1420 that includes display components 1424, 1426, for example abacklight, filter, polarizer, LED array, liquid crystal array,electrodes, and other similar display components. The display 1420 canfurther include a transparent cover 1422 that can be formed of anydesired transparent material, such as polymer, glass, or ceramicmaterial such as sapphire. In some examples, the display can be an LCDdisplay, an LED display, an OLED display, a plasma display, a quantumdot display, or any other type of display known in the art or developedin the future. The device 1400 can further include additionalcomponents, such as a chassis, a battery, processors, a back cover, andother components that are not shown.

FIG. 22 shows an exploded cross-sectional view of an electronic device1500 that can be substantially similar to electronic devices 100, 200,and 1000 described herein. The device 1500 includes a display component1534 and a transparent cover 1532 overlying the display component anddefining an exterior surface of the device 1500. The device 1500 canalso include a housing that has a band 1502 that can be substantiallysimilar to bands 102, 202, and 1002 described herein. In some examples,the band 1502 can include multiple composite components that can bejoined together with a moldable material to form the band. In suchexamples, and as illustrated, the band 1502 can include one or moreexterior portions 1522 including a first material and one or moreinterior portions 1524 including a second, independently selectedmaterial, as described herein. The band 1502 can at least partiallydefine an exterior surface of the device 1500 and an internal volume ofthe device 1500. In some examples, the band 1502 can include a cavity ora space 1540 sized to receive the display component 1534 and including afeature 1542 that is configured to receive the display and/or displaycomponent 1534. In some examples, the feature 1542 can be a recess, lip,protrusion, or other feature configured to receive and mechanically orstructurally support the display component 1534.

FIG. 23 illustrates an assembled device 1500, including an encapsulatingmaterial 1552 at least partially surrounding the periphery of thedisplay component 1534, and joined or bonded directly to the band 1502.As described herein, the encapsulating material 1552 can be any desiredmoldable material and, in some examples, can be a polymer material suchas epoxy or resin. As can be seen, in some examples, the encapsulatingmaterial 1552 can additionally surround a major surface of the displaycomponent 1534, for example the lower major surface. The encapsulatingmaterial 1552 can serve to join or bond the display component 1534 tothe band 1502, and thereby retain the display within the housing of thedevice 1500. Further, in some examples, the encapsulating material 1552can be disposed entirely within the internal volume of the device 1500.For example, where the band 1502 can include a curved surface that atleast partially defines an exterior surface of the device 1500, theencapsulating material 1552 can be positioned interior to the curvedsurface. In some examples, and as illustrated, the encapsulatingmaterial 1552 can be bonded or joined to the band by an adhesive 1554that can securely bond the encapsulating material 1552 and displaycomponent 1534 to the band 1502. In some examples, however, the material1554 can be the encapsulating material 1552 itself.

As can be seen in FIG. 23, in some examples, an edge of the displaycomponent 1534 and the transparent cover 1532 can be substantiallyaligned with one another. Such a configuration can allow for the activearea of the display, for example an area including pixels, to bepositioned substantially closer to the edge of the transparent cover1532 relative to configurations that utilize traditional displaymounting components. Further, in some examples, the transparent cover1532 can be disposed substantially adjacent to the band 1502. Such aconfiguration can create a more seamless visual transition between theband 1502 and the transparent cover 1532. Further, the active area ofthe display can be positioned closer to the band 1502 than mightotherwise be achieved with traditional display mounting components.

FIG. 24 shows a process flow diagram of an exemplary process for formingan electronic device, as described herein. The process 1600 for formingthe device can include at least partially surrounding a periphery of adisplay component with a moldable encapsulating material at block 1610,positioning a transparent cover adjacent to a major surface of thedisplay component at block 1620, and joining the display component andtransparent cover to the frame of the device by the moldableencapsulating material at block 1630.

At block 1610, an encapsulating material can be provided to a displaycomponent in a moldable form to at least partially surround the displaycomponent. For example, where a display or a display component can besubstantially rectangular, the encapsulating material can at leastpartially surround, one, two, three, or all of the sides of the displayor display component. In some examples, the encapsulating material cansurround substantially the entire periphery of a display or displaycomponent. In some examples, the encapsulating material can at leastpartially surround a major surface of the display or display component.For example, the encapsulating material can at least partially surroundthe bottom major surface of a display component. The encapsulatingmaterial can be any desirable form of moldable material. For example,the encapsulating material can include a polymer material, such as anepoxy or resin. In other examples, the encapsulating material can be acomposite material, for example a ceramic or glass reinforced polymermaterial. Alternatively, the moldable material can be a curablematerial, or can be heated to a moldable form, and then cooled tosolidify.

At block 1620, a transparent cover can be positioned adjacent to a majorsurface of the display component. In some examples, the transparentcover can be positioned relative to the display component while theencapsulating material is still in moldable form. In other examples,however, the transparent cover can be positioned adjacent to the displaycomponent after the encapsulating material has hardened or solidified.Alternatively, the transparent cover can be positioned adjacent to thedisplay component prior to surrounding the display component with theencapsulating material.

At block 1630, the display component can be joined or bonded to theframe of the electronic device via the moldable encapsulating material.The encapsulating material can serve to join or bond the displaycomponent to the frame, and thereby retain the display within thehousing of the device. Further, in some examples, the encapsulatingmaterial can be disposed entirely within an internal volume of thedevice. In some examples, the encapsulating material can be bonded orjoined to the frame by an adhesive that can securely bond theencapsulating material and display component to the frame. In someexamples, however, the moldable encapsulating material itself candirectly bond to the frame.

Any of the features or aspects of the components, devices, and methodsdiscussed herein can be combined or included in any varied combination.For example, any methods of forming an element or component of a framefor an electronic device can be used in combination with any of themethods of forming engagement features on a component and forming anelectronic device as described herein. The steps, stages, or blocks ofany of the methods described herein can be performed in any desiredorder and can be performed simultaneously if desired. Further, a housingof a device can include a composite component as described herein thatcan include an engagement feature formed therein. Any method can be usedto form such an engagement feature. Although certain methods andcomponents are described with respect to housings, enclosures, or framesfor electronic devices, the methods and components described herein canalso be or form any number of additional components of an electronicdevice, including internal components, external components, cases,surfaces, or partial surfaces. As used herein, the terms exterior,outer, interior, and inner are used for reference purposes only. Anexterior or outer portion of a composite component can form a portion ofan exterior surface of the component, but may not necessarily form theentire exterior of outer surface thereof. Similarly, the interior orinner portion of a composite component can form or define an interior orinner portion of the component, but can also form or define a portion ofan exterior or outer surface of the component.

Various inventions have been described herein with reference to certainspecific embodiments and examples. However, they will be recognized bythose skilled in the art that many variations are possible withoutdeparting from the scope and spirit of the inventions disclosed herein,in that those inventions set forth in the claims below are intended tocover all variations and modifications of the inventions disclosedwithout departing from the spirit of the inventions. The terms“including” and “having” come as used in the specification and claimsshall have the same meaning as the term “comprising.”

The foregoing description, for purposes of explanation, used specificnomenclature to provide a thorough understanding of the describedembodiments. However, it will be apparent to one skilled in the art thatthe specific details are not required in order to practice the describedembodiments. Thus, the foregoing descriptions of the specificembodiments described herein are presented for purposes of illustrationand description. They are not target to be exhaustive or to limit theembodiments to the precise forms disclosed. It will be apparent to oneof ordinary skill in the art that many modifications and variations arepossible in view of the above teachings.

1. A method of forming a frame element for an electronic device,comprising: joining a boss to an elongate frame member; forming afeature in the frame member by a manufacturing process, wherein theframe member is oriented in one or more desired positions during themanufacturing process via the boss; and removing the boss from the framemember.
 2. The method of claim 1, wherein: the manufacturing processcomprises a subtractive manufacturing process; and the boss isconfigured to engage a positioning apparatus and to mechanically supportthe frame member as the positioning apparatus orients the frame memberin the one or more desired positions to allow for removal of materialfrom a desired portion of the frame member during the subtractivemanufacturing process.
 3. The method of claim 1, wherein removing theboss comprises removing material from the boss to form a feature on theframe member.
 4. The method of claim 1, wherein the manufacturingprocess comprises a machining process.
 5. The method of claim 1, whereinjoining comprises welding, brazing, diffusion bonding, or adhering.
 6. Ahousing of an electronic device, comprising: a metal outer portionincluding a first material having a first set of material properties,the metal outer portion at least partially defining a feature; an innerportion including a second material having a second set of materialproperties independent of the first set of material properties, theinner portion at least partially defining the feature; and an engagementfeature configured to mechanically engage a moldable material, theengagement feature positioned at a surface of the housing defined by theinner portion and the metal outer portion.
 7. The housing of claim 6,wherein the engagement feature comprises at least one of anano-structured or micro-structured feature.
 8. The housing of claim 6,wherein the engagement feature is formed by an etching or machiningprocess.
 9. The housing of claim 6, wherein the engagement feature isformed by an additive manufacturing process.
 10. A method of forming acomponent for an electronic device, comprising: joining a metal portionincluding a first material having a first material property to a secondportion including a second material having a second material propertyindependent of the first material property; forming one or more featuresin the second portion; and treating a surface defined by the metalportion and the second portion to form an engagement feature.
 11. Themethod of claim 10, further comprising molding a material to the surfaceto mechanically engage the engagement feature.
 12. The method of claim10, wherein joining comprises welding, brazing, diffusion bonding,adhering, or die casting the second material into the metal portion. 13.The method of claim 10, wherein treating the surface comprises etchingthe surface or depositing material onto the surface.
 14. An electronicdevice, comprising: a frame element including a surface that at leastpartially defines an exterior surface of the electronic device; adisplay component; a transparent cover disposed adjacent to the displaycomponent; and an encapsulating material in contact with and at leastpartially surrounding a periphery of the display component, theencapsulating material bonded to the frame element and positionedinterior to the surface.
 15. The electronic device of claim 14, whereinan edge of the transparent cover and an edge of the moldable materialare aligned in a plane.
 16. The electronic device of claim 15, whereinthe plane is substantially parallel to and spaced apart from a wall ofthe frame element.
 17. The electronic device of claim 14, wherein theencapsulating material is bonded to the frame element with an adhesive.18. A method of forming an electronic device, comprising: at leastpartially surrounding a periphery of a display component with a moldablematerial; positioning a transparent cover adjacent to the displaycomponent; and joining the display component and the transparent coverto a frame element; the frame element at least partially defining anexterior surface of the electronic device.
 19. The method of claim 18,wherein joining includes bonding the frame element to the moldablematerial with an adhesive.
 20. The method of claim 19, wherein an edgeof the transparent cover and an edge of the moldable material aresubstantially aligned in a plane and the plane is substantially parallelto and spaced apart from a wall of the frame element.